Name: Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore
Brand: Woodhead Publishing
SKU: 9780081025321
Price: 165.00 USD
Availability: InStock

Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

$165.00

Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

Publisher: Woodhead Publishing
ISBN: 9780081025321

Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

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